ENGINEERING BASED TECHNOLOGY COURSES
BGA & CSP MANUFACTURING CLINIC - 2 DAYS
Learn to make your manufacturing methods adapt to BGA and CSP, the next step in package density. Design "rules" will be reviewed with formulas and requirements for long-term reliability, PWB surface requirements, procurement specifications, in house storage and handling, process modifications and necessary control points in the manufacturing process down to the rework and inspection requirements. Take two days and use our instructor's experience and automated processing equipment to steer you away from common mistakes that are made in this subtle conversion process. This course provides you with lecture and hands-on exercises necessary for successful BGA & CSP integration into your existing manufacturing process.
Benefits:
- Learn the BGA process perspective
- Understand process modifications may be required
- Learn about reliability and yield considerations
- Discuss "real-life" case studies with experts
- Perform equipment setups for BGA & CSP manufacturing
This course is designed for process engineers and QA personnel with limited exposure to BGA. Participants are encouraged to bring company requirements to class for review and discussion.
| Course fee |
Course Code |
Dates |
| $950 |
PTRE7050-01 |
10/14-
10/15/08 |
| PTRE7050-02 |
12/09-12/10/08 |
| PTRE7050-10 |
02/10-02/11/09 |
| PTRE7050-11 |
04/14-04/15/09 |
| PTRE7050-30 |
06/09-06/10/09 |
SURFACE MOUNT BOOT CAMP - 5 DAYS
This course uses dynamic multimedia presentation, coupled with challenging exercises and takes you from "trade journal familiar" to hands-on confident. This course steps you through the SMT process from the technical view before going into our fully equipped SMT facility and applying what you have learned. Leading experts will help you learn how to avoid the classic SMT mistakes. Whether your company has an SMT line or you are working with an outside SMT contract manufacturer, this course will help you make process decisions confidently.
Benefits:
- Learn the leading causes of defects and how to prevent them
- Understand how material issues relate to the process outcomes
- Develop an understanding of how design decisions can affect the efficiency of your process
- Experiment with the process so that you can "see for yourself" how changing materials or equipment parameters influences product quality
This course is designed for process engineers, QA personnel and high-level technicians.
| Course fee |
Course Code |
Dates |
| $1,850 |
PTRE7000-01 |
09/22-09/25/08 |
| PTRE7000-10 |
01/26-01/28/09 |
| PTRE7000-12 |
05/04-05/07/09 |
|
PRE CAP VISUAL DEFECT RECOGNITION
AND CERTIFICATION – 1 DAY
Hybrids/MCMs/RF Modules will require a visual
inspection step prior to encapsulating or hermetic seal.
This is a critical process step that requires a high degree of
operator skill and understanding of what to look for an
reject as part of the inspection process. This course defines
the inspection criteria based on traditional Mil Spec guide-lines
(i.e. Mil n Std-883 TM 2017, TM 2010 and TM2032)
in conjunction with industry accepted best commerical
practices. Multimedia Power-Point presentations introduce
the criteria in a classroom setting which are the reinforced
in the lab through hands on exercises at the microscope.
Benefits:
- Learn how to use a stereo zoom and high power (100 to 500X) optical microscope
- Understand what to look for as part of a pre cap visual inspection
- Learn how to interpret and apply traditional Mil Spec visual inspection quidelines.
- Know the commercial industry accepted practices
The course is intended for quality assurance personnel,
inspectors, lead operators and others responsible for
inspection of the hardware prior to the final package seal-ing
process.
| Course fee |
Course Code |
Dates |
| $475 |
PTRE-7031-01 |
09/10/08 |
| PTRE-7031-10 |
01/07/09 |
| PTRE-7031-11 |
05/13/09 |
|
|
WAVE SOLDERING CERTIFICATION FOR OPERATORS AND TECHNICIANS - 3 DAYS
Operators learn appropriate problem–solving skills and gain a better understanding of defect causes and preventative measures. Do your operators really have the process understanding that they need? By attending this course they will not only gain important information, but their skills will be recorded with certification testing and exercises. This is a dynamic, hands-on, practical course that mixes multimedia presentation with labs and exercises so that practical hands-on people see, apply, and understand the material.
Benefits:
- Certify your wave soldering operators for quality systems
- Develop your staff's potential
- Reinforce the industry-best practices
- Increase staff effectiveness
This course is designed for soldering operators and technicians or those who will train them.
| Course fee |
Course Code |
Dates |
| $725 |
PTRE6004-01 |
09/16-09/18/08 |
| PTRE6004-02 |
11/18-11/20/08 |
| PTRE6004-10 |
01/20/-
01/22/09 |
| PTRE6004-11 |
03/17-03/19/09 |
| PTRE6004-12 |
05/12-05/14/09 |
|
|
ADVANCED PACKAGING OVERVIEW - 1 DAY
With so many electronic packaging options available it's difficult to know which path to take to remain competitive in the marketplace. This class is intended as an introduction to some of the many packaging approaches available, including MCM, BGA, CSP, TAB, HDI, etc.
Benefits:
- Learn about future packaging trends
- Review capital equipment and required infrastructure
- Review yield and throughput considerations
- Know the technical highlights of each packaging approach
This course is designed for engineers and managers interested in exploring new packaging technologies.
| Course fee |
Course Code |
Dates |
| $475 |
PTRE7018-01 |
09/11/08 |
| PTRE7018-10 |
01/08/09 |
| PTRE7018-11 |
05/13/09 |
|
|
SOLDERS AND SOLDERING - 2 DAYS
This course will enable the attendee to understand how yield and reliability can be imporved during the soldering processes of through-hole and surface mount technologies in order to create robust solder joints. Practical "hands-on" analysis and determination will increase attendee understanding and aid in implementing new process enhancements for their company.
Benefits:
- Understand solder mechanics and fluxes
- Learn how to evaluate materials using ANSI 002 & 003 documents
- Know how to improve hands-on soldering and mass soldering technologies
| Course fee |
Course Code |
Dates |
| $925 |
PTRE7043-01 |
09/23-09/24/08 |
| PTRE7043-02 |
11/06-11/05/08 |
| PTRE7043-10 |
01/06-01/07/09 |
| PTRE7043-11 |
03/17-03/18/09 |
_____________________________________
IC MANUFACTURING & INTRO TO PCB FABRICATION – 3 DAYS
This course has been developed out of a need for staff engineers, parts quality and supplier development personnel to increase their knowledge base of component level requirements.
DAY 1-2
1. Design Considerations
a.Thermal Management and Related Issues
b. Heavy Wires and Power requirements
2. Integrated Circuit Wafer Fabrication
a. Wet Processes
1) Raw materials-silicone dopant materials
2) Photofabrication
3) Sawing and singulation
b. Assembly Processes
1) Die Bond
2) Wire Bond
3) Encapsulation
c. Materials and Visual Defects
1) Visual Defects – Cause and Effect Analysis
2) Use Workmanship Stds for Microcircuits & RF/MMIC
3. Hands-on Processes and Demonstrations
1) Die and Substrate Bonding Processing
2) Pull testing and Ball Shear
3) Processes Analysis and Defect Recognition
4. Advanced Packaging for Collision Avoidance
a. GaaS Component Level Issues
b. RF/MMIC Assemblies
c. Power Packaging and Chip-on-flex
DAY 3
5. PCB Design and Manufacturing Processes
a. Current PCB Construction and Capabilities
1) Immersion Processes vs. SMOBC/HASL
2) Use Standard - IPC-A-600 – PCB Acceptability Review
b. New Laminate Materials
c. Microvia Technology
d. Integrated Passives
6. Design for Manufacture (DfM) Basics
a. Design Review for “Best Practices”
7. Underfill Process Technology
a. Laminate–based CSP/Flip-chip Solder Joining
b. Materials and Processes for High First-pass Yields
c. Visual Defects – Cause and Effect Analysis
Course Fee: $1,450.00
|
COURSE CODE |
DATES |
|
PTRE7060-01 |
09/16-09/18/08 |
|
PTRE7060-02 |
11/11-11/13/08 |
|
PTRE7060-10 |
03/24-03/26/09 |
|
PTRE7060-11 |
05/12-05/14/09 |
_____________________________________________________
PROCESS AUDIT FUNDATMENTALS
2 DAYS
The outcome of this course is to enable the students to 1) understand the complex manufacturing processes, 2) evaluate them, 3) be able to apply industry standards to them, and 4) conduct a comprehensive audit of them. They will have a better understanding of vendor capabilities (strengths and weaknesses). The application of these tool sets will establish and provide a better partnership and perspective which benefits everyone being on the "same page". This course will help eliminate the breakdown in communications which may exist between the service provider and the customer. The end results will be reduction of process defects, machine down time, later deliveries, and product field failures.
STUDENTS WILL USE & BE FAMILURE WITH:
- NTCµ Custom Audit Tool Package (CD-ROM included) and Companion Workbook
- PC Boards-ANSI/IPC-A-600D, J-STD-003
- Components – ANSI/J-STD-002, EIA -481A
- Materials – ANSI/J-STD-004, 005, 006
This course will review the alphabet of electronic technology, component attachment and interconnecting technologies, facility safety and environmental considerations, and cause and effect of common defects.
Students will develop a style of communication for performing a process audit and increase their effectiveness for gathering important sets of information.
Course Fee: $795.00
|
COURSE CODE |
DATES |
|
PTRE7055-01 |
09/23-09/24/08 |
|
PTRE7055-02 |
11/11-11/12/08 |
|
PTRE7055-10 |
02/24-02/25/09 |
|
PTRE7055-11 |
05/12-05/13/09 |
|
PTRE7055-30 |
06/09-06/10/09 |
___________________________________________________
LEAD-FREE SOLDERING – 2 DAYS
A theory and hands on analysis of the compatibility and conversion requirements for lead free soldering.
BENEFITS:
· Historical Perspective of Solders and Soldering
- Design, Manufacturing and Use Environment
- Functional Attributes and Conditions for Eutectic Soldering
· Lead-free Legislation
- Reactions to the Lead-free World
- Lead-free Drivers and Domestic Initiatives
- Lead-free Movement – EU and Asia Requirements and Compliant Date
· Alloy Alternatives and Choices
- SAC Alloys Showing Promises
- Observations of Lead-free and Electrical Functionality
- Design and Reliability Requirements
· Material Issues
- Printed Circuit Board Surface Alternatives and Increased Temperature
- Component Lead/Termination Alternatives and Increased Temperature
- Vendor Issues Required for Integration
· What can we expect?
- The Performance of SAC Alloys (Degree and Speed of Wetting)
· Manufacturing Requirements and Initiatives
- Press-fit Connections and Machinery Metrics
- Hand Soldered Connections
- Technique, Tools and Education
- Process Yields Analysis
- Wave Soldered Connections
- Compliant Machinery and Maintenance
- Process Analysis
- Reflowed Solder Connections
- Use of N2 in Reflow Soldering
- Use of Modified Solder Paste
- Process Analysis
- Costs Associated with Lead Free Soldering Operations
· Lab-Hands-on Exercises
- Hand Soldering and Pull Testing
- Inspection of Finished Goods – Visual Attributes (Old/New)
- Machine Soldering and Pull Testing
- Inspection of Finished Goods – Visual Attributes (Old/New)
Course Fee: $1,200.00
|
COURSE CODE |
DATES |
|
PTRE7056-01 |
09/16-09/17/08 |
|
PTRE7056-02 |
11/18-11/19/08 |
|
PTRE7056-10 |
02/17-02/18/09 |
|
PTRE7056-11 |
05/26-05/27/09 |
