MEET THE INSTRUCTORS
All lead NTCµ instructors and Adjunct professor's posses personal hands-on knowledge of the subject 
matter and have years of industry training and experience, along with the appropriate level of academic qualifications. NTCµ instructors are recognized experts in their fields, many of whom still work full time in industry. This fact sets apart and distinguishes the NTCµ training programs from the competition. NTCµ instructors are not ivory tower professors, but skilled teachers with strong, proven track records in industry.
John Barkanic
John Barkanic has a bachelor's degree in Chemical Engineering from Penn State University and a masters degree for his work in Penn State's Solid State Device Laboratory. John has over 18 years of experience in materials processing for electronics manufacturing, half of which he obtained as a consultant to the industry. John has published over 30 papers and presentations in the area of materials processing for integrated circuit fabrication and has been issued several US patents for his work in Thin Film fabrication. He currently holds an adjunct professorship in the mathematics department at Allentown College.
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Dennis Barrick
Dennis Barrick has 22 years of experience in the radio frequency (RF) and microwave electronics industry. Dennis has commercial and military expertise in Thick Film Hybrids, Surface Mount techniques, conventional printed circuit board technology and System integration techniques. Dennis has developed and led the implementation of a corporate operating system that resulted in an ISO-9000 certification. Dennis has spent considerable time designing training programs and performing training in Hybrid Assembly, Surface Mount (SMT) Assembly, Thick Film Circuits Design Requirements, Production Operations Management and Continuous Process Improvement Programs. His recent projects include re-engineering a corporation from a functional organization to a strategic business unit (SBU) type of organization.
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Nicole L. Cavanah
Nicole Cavanah is a Materials and Process Development Engineer in the Advanced Technology Center for Rockwell Collins, a manufacturer of communication and aviation electronics, in Cedar Rapids, Iowa. Ms. Cavanah is graduated from Iowa State University with a B.S. in Ceramic Engineering in 1993. She joined Rockwell Collins in May 1993 as an Advanced Operations Process engineer for development of new interconnect and assembly processes, including material evaluation, training, analysis and process verification. Ms. Cavanah serves as a technical expert on call for ceramic materials, microelectronics assembly and cleanrooms.
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Tom Green
Tom Green has MCMs, Hybrids and RF Modules materials and process expertise along with 15 years of experience at Lockheed Martin Astro Space and USAF Rome Laboratories. Tom is experienced in the application of SPC/DOE techniques in a microelectronics manufacturing environment. Tom is a member of IMAPS National Technical Program Committee. Tom received a bachelor of science degree in metallurgy and materials engineering from Lehigh University and a master's degree in engineering from the University of Utah. Tom has published numerous technical papers and journal articles.
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Kerm Heid
Kerm Heid received his Bachelor's Degree in Electrical Engineering and a Master's Degree in Engineering from the University of Illinois. He has thirty years of experience in the Hybrid industry with particular emphasis on process development and productivity enhancement and covers the gamut of volume, complex MCMs to high volume commercial hybrids. He is an IMAPS Fellow and, in 1982, received the Daniel Hughes Award for "..his contribution to the advancement of thin film technology."
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John Kratz
Has an international reputation for technical training, transfer and consulting in the development of new electronics manufacturing processes and procedures. He has served the regional, national and international markets for the last twenty-five years and continues to provide direction and problem resolution to many companies partnering with NTCµ. His ability to couple quality systems such as IPC-A-610 and “best practices” with the assembly process and its defect modes enables people to build an effective and proficient knowledge base. The engineering community which he serves utilizes his services for many problem solving issues related to continuous flow manufacturing and reliability related issues. John is presently the Technical Director for NTCµ Programs.
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David Malanga
David Malanga is currently the Technical Service Manager for Thick Film Products at Heraeus Inc. Cermalloy Division. Dave has 11 years at Heraeus working both in R&D formulating materials (resistors, conductors, and dielectrics) and in Technical Service solving processing and application problems directly with customers. Dave earned a B.S. in Ceramic Science and Engineering from Rutgers University and a M.S. in Ceramic Science and Engineering from Rutgers University. In addition he has published various articles on Thick film resistors, conductors, and component metallizations, LTCC materials, and fiber optic materials.
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Jeffrey M. McGinley
Jeff holds degrees in electronics technology, industrial automation and industrial management. He has over 25 years experience in the electronics industry. He has held positions in manufacturing engineering, test engineering, quality assurance, business development and operations. Jeff has worked for OEM's as well as tier 2 & 3 contract assembly companies. Currently he is a principle with K&L Services a small electronics manufacturing services and consulting firm, which specializes in helping customers move their designs thru prototyping into production.
Jeff is also and IPC Certified Instructor.
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Kyiacos "Charlie" Orphanides
Charlie Orphanides has been intimately involved in the microelectronics industry since the 1960's. He has held managerial and staff positions in quality control, manufacturing, and marketing with various Hybrid microelectronics and packaging companies in the Northeast. He has worked for Industro Transistor, ILC Data Device Corporation, Circuit Technology, Inc., Aeroflex and Isotronics. A past president of the Metropolitan Chapter (NY) for the International Society of Hybrid Microelectronics, Mr. Orphanides is presently a member of the Florida Chapter. He has served on the Executive Board of the committee on Hybrid of the Joint Electron Device Engineering Council (JEDEC) of the Electronic Industries Association. He has also served as the Chairman of Task Groups that developed electronic package specifications for the above organizations. Mr. Orphanides has lectured on Microelectronics Interconnections and Packaging for Universities and other organizations. He is the author of various articles in the field of Package Technology. Mr. Orphanides received his B.S. Degree in Physics from Queens College of the City University of New York and has completed advanced work in Applied Physics at Adelphi University.
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George Riley
George Riley has over 20 years experience in microelectronics packaging. His ten years in flip chip include setting up and operating a manufacturing facility for product development and volume manufacture of flip chip assemblies for more than 40 companies. George has authored 23 flip chip papers and articles, including six web-based tutorials. His dedicated, neutral web site, http://www.flipchips.com/ , is a leading on line source for flip chip information. He holds a M.S. in physics from Cornell University, and M.A. in economics, an M.B.A. in marketing, and a Ph.D. in econometrics.
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Jeff Shakespeare
Jeff Shakespeare holds a Ph.D. in Mechanical Engineering from Lehigh University and has over 19 years of experience in the areas of electronic packaging, microelectronics packaging, and optoelectronics. He is currently a Distinguished Member of Technical Staff at Lucent Technologies developing new packaging technology for fiberoptic lasers and holds several U.S. patents. Jeff has extensive experience leading both R&D and Manufacturing, having spent much of his career developing and introducing new products to manufacture, including fiberoptic transmitters, receivers and amplifiers as well as data modems, rack mounted digital equipment service units, and business telephones.
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